Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Autor:
Springer Us
Verlag:
Springer Us
Sprache:
English
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CHF 134.00
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ISBN
978-1-461-37374-2
EAN
9781461373742
Erscheinungsjahr
11/2/2012
Edition
Softcover reprint of the original 1st ed. 1999
Verlag
Springer Us
Author
Goodson, Kenneth E.;Sungtaek Ju, Y.
Sprache
English
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