Étude de la croissance dendritique du cuivre dans l'acide oxalique
Application au procédé de nettoyage post-CMP en microélectronique
Autor:
Éditions universitaires européennes
Verlag:
Éditions universitaires européennes
Sprache:
French
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Untertitel
Application au procédé de nettoyage post-CMP en microélectronique
ISBN
978-6-131-59706-0
EAN
9786131597060
Erscheinungsjahr
10/5/2011
Verlag
Éditions universitaires européennes
Author
Ostermann, Elodie
Sprache
French
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