Substrate Noise Coupling in Mixed-Signal Asics
Autor:
Springer Us
Verlag:
Springer Us
Sprache:
English
From the reviews:
"This book covers modeling and simulation for the noise from substrate. This book reviews the causes of noise in substrate and possible prevention of the noise. … As a practicing engineer, I feel that their techniques for noise prevention are legitimate and applicable. This book is worthwhile for IC design engineers. Those engineers that work on integration of analog and digital parts may want to read this book to prevent any malfunctioning ICs." (IEEE Circuits & Devices Magazine, Vol. 20 (5), September/October, 2004)
CHF 188.00
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ISBN
978-1-402-07381-6
EAN
9781402073816
Erscheinungsjahr
2/28/2003
Edition
2003
Verlag
Springer Us
Sprache
English
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